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multilayer pcb 6layers pcb electronics motherboard PCB Red solder mask PCB Industrial control motherboard pcb boards

Name: multilayer pcb 6layers pcb electronics motherboard PCB Red solder mask PCB Industrial control motherboard pcb boards
Brand: hengsheng
Price: 0.1 USD

Quality multilayer pcb 6layers pcb electronics motherboard PCB Red solder mask PCB Industrial control motherboard pcb boards for sale

Certification : UL,ISO9001,TS16949

MOQ : 1pcs

Price : USD 0.1-5/pcs

Payment Terms : T/T, Western Union,paypal

Supply Ability : 100000pcs per month

Delivery Time : 7-10working days

Packaging Details : 25kgs/carton, vacuumed packing

Brand Name : hengsheng

Model Number : HSF1068

Place of Origin : china

Marerial : FR-4

Thickness : 1.6mm

Copper : 35um

Surface : ENIG

Mask : Red

Board Thickness : 0.2-3.2mm

Copper Thickness : 1/2oz-5oz

Impedance Control : Yes

Layer Number : 2-10

Material : FR4, CEM-1, CEM-3, High TG, Rogers, etc.

Max. Board Size : 1200*600mm

Min. Hole Size : 0.2mm

Min. Line Spacing : 0.075mm

Min. Line Width : 0.075mm

Silk Screen Color : White, Black, Yellow, etc.

Solder Mask Color : Green, Blue, White, Black, etc.

Surface Finishing : HASL, ENIG, OSP, Immersion Gold, etc.

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Process Capability And Checking Parameters(Hard Board)
NO	ITEM			Technical Capabilities
1	Layers			1-38L
2	Max.Board Size			1200*610mm
				48"*24"
3	Finished Board Thickness			0.2mm--10.0mm
				0.008"--0.4"
4	Finished Copper Thickness			17um-420um
				0.5OZ--12OZ
5	Min.Trace Width/Space			0.075mm/0.065mm
				0.003"/0.0026"
6	Min.Hole Size			0.15mm
				0.006"
7	Hole Dim. Tolerance(PTH)			±0.05mm
				±0.002"
8	Hole Dim.Tolerance(NPTH)			±0.05mm
				±0.002"
9	Drill Location Tolerance			±0.05mm
				±0.002"
10	V-Cut Degrees			20-90 ºC
				20DEG-90DEG
11	Min.V-Cut PCB Thickness			0.4mm
				0.016"
12	N/C Routing Tolerance			±0.1mm
				±0.004"
13	Min.Blind/Buried Via			0.15mm
				0.06"
14	Plug Hole Size			0.2mm--0.6mm
				0.008"--0.024"
15	Min.BGA PAD			0.2mm
				0.008"
16	Materials			FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB

17	Surface Finish			HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F

18	Warp & Twist			≤0.75%

19	Electrical Testing			50--300V

20	Solderability Testing			245±5ºC,3sec Wetting area least95%

21	Thermal Cycling Testing			288±5ºC,10sec,3cycles

22	Ionic Contamination Testing			Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm

23	Soldmask Adhesion Testing			260ºC+/-5, 10S,3times



Process Capability - Technical Parameters(FPC)
Content	Common	Special	Surface treatment	Thickness
Minimum line width	0.07mm	0.05mm	Electroplated nickel gold	Ni:3-9um;Au:0.03-0.1um
Minimum line spacing	0.07mm	0.05mm
Minimum Drilling aperture	Φ 0.15mm	Φ 0.1mm
Aperture Tolerance	±0.1mm	±0.05mm	Chemical immersion gold	Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (double panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)	610*1650mm		Electroplated hard gold	Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance	±10%		Electroplated pure tin	Sn:3-7um
Maximum production layer	12L
Thickness To Diameter Ratio	2:1(Minimum aperture 0.1mm)
	5:1(Minimum aperture 0.2mm)		Anti-oxidation
	8:1(Minimum aperture 0.3mm)
Monthly production capacity/m²	16000 m²

Material
Substrate Material	PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium	Copper foil(1/3oz,1/2oz,1oz,2oz)
	Constantan
	Silver Paste
	Copper Ink
Adhesive	Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film	PI(0.5mil,1mil,2mil)(Yellow, White, Black)
	PET(1mil,2mil)
	Solder mask (green, yellow, black...)
Glue	3M467,3M468,3M9077,TESA8853...
Reinforcement Type	PI,FR4,PET,Steel,Aluminum...

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